HID Global, a worldwide leader in secure identity solutions, recently announced an ultra-thin Polycarbonate (PC) ePrelaminate inlay for electronic ID (e-ID) cards that is more than 30 percent thinner than alternatives. The new offering is the first HID Global inlay to use its patented HID direct bonding platform technology, which is available for high frequency (HF) systems. NXP Semiconductors is HID Global’s first qualified partner supplying IC chips for this product.
Direct bonding technology
