HID Global, a worldwide leader in secure identity solutions, recently announced the strength of its breakthrough patented crack prevention technology for IC chip-enabled polycarbonate eID and e-passport credentials has been validated in the recent test conducted by Smithers Pira, the worldwide authority in the packaging, paper and print industry supply chains. In laboratory testing, 100% of cards created using HID Global’s crack prevention solution were found to be immune to premature aging caused by the minuscule cracking that in some instances has been known to occur when a chip is introduced to a polycarbonate card body. Cards without the crack prevention technology failed the test.
The company’s crack prevention technology is currently used in government-to-citizen ID programmes, including a flagship deployment of more than 10 million cards for a major European advanced eID programme. Polycarbonate, due to its unique strength and flexibility, has won the trust of governments as the material of choice for durability and tamper resistance and is also valued for its capabilities as a platform supporting the very high quality optical features of security printing. HID Global’s unique crack prevention feature optimises the reliability and durability of smart cards and e-passport datapages by enabling government customers to leverage the advantages of smart card technology on a polycarbonate platform and protect their investment by extending the life of the credential.
