NXP Semiconductors N.V. recently announced a strategic collaboration with HID Global®. The HID Global Seos® credential technology will be embedded in NXP’s SmartMX-based secure element devices. Through the collaboration, NXP and HID Global aim to enable the use of wearable devices, to open electronic locks at commercial buildings, hotels and workplaces in the future. Additionally, NXP and HID Global are cooperating on a broad range of opportunities to expand the adoption of secure access to more applications and use cases.
Wearables manufacturers worldwide with the Seos-ready NXP chips can enable users with building and parking access, PC login, authentication to IT systems and cloud applications, secure print job collection, time and attendance, point of sale and automated cashless vending, along with numerous other use cases supported by Seos. HID Global’s field programmers will support these use cases in Seos-ready wearables simply with the support of loading digital credentials of specified applications.
